Unfilled Polyimide Wafers and Polyimide Substrates
Polyimide wafers, substrates, and precise polyimide shapes are now available from Valley Design. Ultra-thin, ground, lapped or polished pure unfilled polyimide is ideal for thin films, solar cell substrates, multilayer substrates, MEMS microstructures and packaging applications.
Why Polyimide?
- Low dielectric constant
- Flexible
- Polishable to Angstrom level surface finishes
- Excellent dimensional stability
- Low water absorption
- High temperature stability
- Excellent machinability
- Low outgassing and non-contaminating
- Exceptional mechanical strength
- Low coefficient of thermal expansion
Polyimide wafers polished on one side with 5nm Ra surface finish available from stock:
| PART # |
THICKNESS |
DIAMETER |
| PI – P1 – Ø2X020 |
0.020″ |
2″ |
| PI – P1 – Ø3X020 |
0.020″ |
3″ |
| PI – P1 – Ø100XØ500 |
500 µm |
100 mm |
| PI – P1 – Ø150XØ500 |
500 µm |
150 mm |
Valley Design’s special polyimide processing capabilities:
- Ultra-thin wafers to 50 micrometers
- Tight thickness tolerances
- Double side polishing
- Complex shapes
- Small diameter holes
- Precision dicing
- Large geometry polishing capability
Please call or email for a quotation to meet your requirements.
Valley Design Corp. manufactures polished polyimide wafers under license from Opticomp Networks US Patents No. 6, 563, 998 and 6, 807, 328.