Polyimide Substrates, Polyimide Applications and Polyimide Properties

Unfilled Polyimide Wafers and Polyimide Substrates

polyimide wafer image

Polyimide Wafer

Polyimide wafers, substrates, and precise polyimide shapes are now available from Valley Design. Ultra-thin, ground, lapped or polished pure unfilled polyimide is ideal for thin films, solar cell substrates, multilayer substrates, MEMS microstructures and packaging applications.

Why Polyimide?

  • Low dielectric constant
  • Flexible
  • Polishable to Angstrom level surface finishes
  • Excellent dimensional stability
  • Low water absorption
  • High temperature stability
  • Excellent machinability
  • Low outgassing and non-contaminating
  • Exceptional mechanical strength
  • Low coefficient of thermal expansion

Polyimide wafers polished on one side with 5nm Ra surface finish available from stock:

PI - P1 - Ø2X020 0.020" 2"
PI - P1 - Ø3X020 0.020" 3"
PI - P1 - Ø100XØ500 500 µm 100 mm
PI - P1 - Ø150XØ500 500 µm 150 mm

Valley Design's special polyimide processing capabilities:

  • Ultra-thin wafers to 50 micrometers
  • Tight thickness tolerances
  • Double side polishing
  • Complex shapes
  • Small diameter holes
  • Precision dicing
  • Large geometry polishing capability

Please call or email for a quotation to meet your requirements.

Valley Design Corp. manufactures polished polyimide wafers under license from Opticomp Networks US Patents No. 6, 563, 998 and 6, 807, 328.